Plenary
| M.J. Kushner | Univ. of Michigan, USA |
| TBD | |
Plenary
| E. Hudson | Lam Research Corp., USA |
| Vacuum ultraviolet plasma emission in a dielectric etch reactor | |
Plenary
| M. Koyanagi | Tohoku Univ, Japan |
| Three-Dimensional Integration Technology Using Self-Assembly Technique | |
Plenary
| C.J. Kang | Samsung Electronics CO., LTD, Korea |
| Innovative Technologies for New Semiconductor Era | |
Invited
| L. Chen | Tokyo Electron America, Inc., USA |
| EEDF of the DC+RF Hybrid and its Effects on Etching Process | |
Invited
| J. Matsuo | Kyoto Univ., Japan |
| Nanoprocessing with Cluster Beams-Challenges and Opportunities | |
Invited
| N. Miyakawa | Honda Research Institute Japan Co., Ltd, Japan |
| Multi-layer Stacking Technology using Direct Connection between TSV and Bump | |
Invited
| S. Rauf | Applied Materials, Inc., USA |
| Three-dimensional modeling of plasma processing equipment | |